CHIATECH JOURNAL · Registered Version of Record

Microlearning for Faculty TPACK Development in Higher Education: An Evidence-Informed Design and Evaluation Framework

1. Shiaondo Kenneth Chia · ORCID 0009-0009-6434-4586
   CHIATECH Solutions and Resources Ltd, Abuja, Nigeria

Abstract

Background: Faculty are expected to integrate rapidly changing digital and AI tools into teaching, yet professional development is often detached from disciplinary content, constrained by time and evaluated mainly through self-report. Objective: This article develops an evidence-informed microlearning architecture for strengthening faculty TPACK through authentic, discipline-linked practice and multi-source evaluation. Methods: A critical design synthesis connected the Technological Pedagogical Content Knowledge (TPACK) framework with recent systematic reviews of micro-courses, teacher digital competence and AI-focused professional development. Results: Microlearning is most defensible when short modules are embedded in an iterative cycle of diagnosis, focused instruction, authentic teaching practice, feedback, reflection and evidence of transfer. Five-to-ten-minute units can lower participation barriers, but duration alone does not create learning; modules must be sequenced around real pedagogical problems and supported by practice. The proposed 12-week model progresses from baseline diagnosis and core integration decisions to discipline-specific design, assessment/AI use and classroom transfer. Evaluation should combine TPACK measures with artifact rubrics, technology-use logs, observations, student feedback and interviews. Conclusion: Microlearning can be a practical delivery architecture for faculty TPACK development, but its effectiveness depends on coherence, authentic application, institutional support and multi-source evaluation rather than on the brevity of content.

Keywords: TPACK; microlearning; faculty development; higher education; teacher digital competence; professional development; AI in education

Licence: Creative Commons Attribution 4.0 International (CC BY 4.0)

Published by CHIA TECH SOLUTIONS AND RESOURCES LIMITED. ISSN assignment remains pending.